New Electronics

ACM Research strengthens FOPLP portfolio with launch of Ultra ECP ap-p Tool

ACM Research, a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, has launched the new Panel Electrochemical Plating (Ultra ECP ap-p) tool. This ...
Yahoo Finance

ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool

FREMONT, Calif., Aug. 07, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...
Yahoo Finance

ACM Research Expands Fan-Out Panel-Level Packaging Portfolio with Launch of Ultra C bev-p Bevel Etching Tool

FREMONT, Calif., Sept. 03, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...
Digi Times

ACM launches Ultra C vac-p flux cleaning tool for chiplets, breaking into FOPLP market

ACM Research has introduced its Ultra C vac-p flux cleaning equipment, specifically designed for fan-out panel-level packaging (FOPLP). This new tool employs vacuum technology to efficiently remove ...
The Globe and Mail

ACM Research Unveils Ultra ECDP Electrochemical Deplating Tool for Compound Semiconductor Gold Etch Processes

FREMONT, Calif., Sept. 17, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging ...