Multiple scrapped levels from Sonic The Hedgehog 2 have been found and recreated in a fascinating new historical dig. All games have tons of content that don’t make it into the final game, and Sonic ...
Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...
The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked ...
Hsinchu, Taiwan – July 15, 2025 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express™ (UCIe™) ...
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