The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...

A research team has developed a new thin film deposition process for tin selenide-based materials. This process utilizes the metal-organic chemical vapor deposition (MOCVD) method, enabling thin film ...

It uses two wafers instead of one, along with ultra-thin dielectric bonding ...

Due to superior material properties of SiC for high-voltage devices, SiC Schottky diodes are used in energy-conversion systems such as solar-cell inverters, battery chargers, and power modules for ...

South Korean researchers have developed a process to produce ultra-thin wafers without sacrificing any of the substrates. Their technique is based on a new approach involving the use of ...

In roll-to-roll (R2R) manufacturing, varied inspection systems have been explored to measure the coating thickness on large substrate areas. Existing thin-film inspection systems provide opportunities ...

Global Thin Wafer Market to grow from USD 5.2 billion in 2024 to USD 8.4 billion by 2030 as chipmakers prioritize thinner substrates for advanced packaging, high-performance electronics, EV power ...

True to Moore's Law, the number of transistors on a microchip has doubled every year since the 1960s. But this trajectory is predicted to soon plateau because silicon—the backbone of modern ...

Hongyuan Green Energy says it has produced a first batch of 40 µm monocrystalline silicon wafers that support full-size and half-cut formats, with slicing completed using the company’s in-house ...

The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...