The embedded Memory Block (eMB) is an instantiated memory from the silicon foundry or a third party and can easily be integrated into the eFPGA definition. In addition, an Interconnect grid of ...
Mirabilis Design announced today the latest addition to the VisualSim Architect with modelling support for Arteris’ FlexNoC ...
Introduction: The explosive growth in the electronic industry over the last 20 years ... in an excel sheet in order to select the system worst case and to define an oversized interconnect. As the ...
which just are by definition going to have a more intensive content of interconnect products for our industry and where Amphenol, we're confident we're going to gain more than our fair share of ...
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Keysight Upgrades Chiplet PHY Designer With Enhanced SupportKeysight Technologies, Inc. KEYS recently launched the latest version of its Chiplet PHY Designer 2025, a cutting-edge solution for enhancing high-speed digital chiplet design for AI and data center ...
The case at hand involves the classification of various components, such as LCD panels, touch screens, and printed circuit boards (PCBs), used in automotive infotainment systems under the Customs ...
interconnection arrangements and exchange points, spam, cybersecurity, universal access/service, intellectual property rights and privacy. Others think that a narrow definition should be taken: namely ...
It was at that point that the term Intelligent Electronic Device (IED ... should be considered for use by all utilities, since they define the basic elements of the grid and their interconnection and ...
Tech Xplore on MSN3d
High-definition organic LED microdisplays with reduced electrical crosstalk could enhance VR and AR experiencesThe rapid advancement of the electronics industry is opening new possibilities for the development of increasingly advanced ...
Def Leppard played their first show of 2025 on Saturday night in Leon, Mexico, but one of the band’s members was noticeably absent from the group. “Vivian Campbell cannot be with us tonight ...
Optimization of the Inter-Chiplet Interconnect And The Chiplet Placement (ETH Zurich, U. of Bologna)
A new technical paper titled “PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies” was published by researchers at ETH Zurich and University of Bologna. “2.5D integration technology is ...
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