IEEE

Scaling Up Multi-Agent Reinforcement Learning: An Extensive Survey on Scalability Issues

Abstract: Multi-agent learning has made significant strides in recent years. Benefiting from deep learning, multi-agent deep reinforcement learning (MADRL) has transcended traditional limitations seen ...
IEEE

Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

Abstract: The EMIB dense MCP technology is a new packaging paradigm that provides localized high density interconnects between two or more die on an organic package substrate, opening up new ...