The siemens_to_ismrmrd converter is used to convert data from Siemens raw data format into ISMRMRD raw data format. Multiple Parameter map XML and Parameter stylesheet XSL files are embedded in ...
In a recent Materials & Design publication, researchers introduced a novel high entropy CoNi-based superalloy, referred to as CoNi-HESA, engineered for superior performance under high-temperature ...
Optimize MyProgramming /3D Scanner is a control-integrated solution for shop floor-oriented CNC programming based on 3D CAD geometry. July 29, 2025 - At EMO 2025, Siemens will introduce Optimize ...
Siemens Digital Industries Software announced the latest updates to its NX and NX X software from the Designcenter suite of product engineering software, including immersive engineering for mixed ...
Siemens’ industry-leading Calibre® nmPlatform tool is now certified for the latest Intel 18A production Process Design Kit (PDK). Intel 18A represents a significant technological leap forward, ...
We’re talking about Siemens Digital buying Downstream Technologies, the UK’s Ministry of Defence putting £200m into compound semis, a 3D magnetic sensor, and the Satellite Applications Catapult ...
Siemens Digital Industries Software has expanded its collaboration with Microsoft to make its cloud-enabled NX X software for product engineering available through Microsoft’s Azure cloud and AI ...
German industrial tech firm advances edge computing capabilities and digital twin technology through partnerships, launches startup programme with AWS The integration of AI into manufacturing ...
Siemens received 510(k) clearance for its Mammomat B.brilliant mammography system in April. The Food and Drug Administration clearance covered elements involving 2D breast imaging, breast biopsy and ...
Three-dimensional imaging outperformed older digital mammography at reducing anxiety-producing callbacks for more breast cancer testing, a new study shows. The research, published this month in the ...
Siemens Digital Industries Software has introduced new software for the planning and heterogeneous integration of ASICs and chiplets using the latest 2.5D and 3D semiconductor packaging technologies ...
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